Mînzu, V. and Arama, I. (2025) A New Method to Predict the Mechanical Behavior for a Family of Composite Materials. Journal ...
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...
Neurodegenerative diseases—such as Alzheimer’s, Parkinson’s, Huntington’s, and ALS—are progressive disorders characterized by the loss of structure and ...
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