XDA Developers on MSN

4 reasons you shouldn't boot your Raspberry Pi from a microSD card

Discover the drawbacks of booting Raspberry Pi from SD cards and explore faster, more reliable alternatives for improved performance and longevity.
IEEE

Fluorocarbon Film Deposition Using Reactive Ion Etcher and Its Application for Physical Analysis of 3D Stacking TSV, Micro Bump and Hybrid Bonding

Abstract: Through-silicon via (TSV), micro bump, and hybrid bonding are three critical structures for three-dimensional (3D) integrated circuits (IC) stacking technology. The large-scale (~urn level) ...