Abstract: Heterogeneous 3D integration technology is a cost-effective and high-performance alternative to planar integrated circuits (ICs). In this paper, we propose an on-chip power distribution ...
UC San Diego engineers create a soft vine robot that twists through arteries and jet engines with liquid crystal skin.
Abstract: The mismatch in thermal expansion coefficients among different materials leads to nonuniform deformation in a package, known as warpage. The warpage has become a significant reliability ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback