Abstract: TEG chips were assembled on 2.3D i-THOP (integrated-Thin film High density Organic Package) and reliability tests were conducted at the package level. It was confirmed that low CTE UFR ...
Intel Corporation secures $18B+ from Nvidia, SoftBank, and the U.S. government, bolstering liquidity & credibility. Learn ...
Abstract: This article presents a numerical approach for computing and synthesizing the force between two permanent magnets (PMs) under general conditions. Initially, a general formula for determining ...
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