In 'brutal' interview, SAP CFO says AI means the company can produce more software with fewer people

In an exclusive interview, Dominik Asam shared frank views on how AI is changing back-office and engineering roles at the ...
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Automating FOWLP design: A comprehensive framework for next-generation integration

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...