Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
Abstract: Driven by the demands for higher efficiency, miniaturization, and thermal performance, the power density of wide-bandgap power semiconductor devices, particularly SiC-based modules, has been ...
Some of the highest-ranking officials in the federal government used Charlie Kirk’s podcast, guest-hosted by Vice President JD Vance, to lay out their plans. By Katie Rogers and Zolan Kanno-Youngs ...
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