Abstract: A highly intensive active phased array (APA) terminal typically integrates a variety of complex modules on a multi-layer printed circuit board (PCB), including beamformer chips, an up- and ...
Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density.
Abstract: This paper analyzes the security of Internet of Things (IoT) devices from the perspective of sensing and actuating. Particularly, we discover a vulnerability in power supply modules and ...
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