Semiconductor Engineering

Enhancing Test Socket Performance Through Application-Specific Validation And System-Level Per-Pin OQC

The gap between lab measurements and real-world applications can lead to suboptimal socket selection and hidden quality risks ...

Full Analysis of Plastic Material Selection for New Energy Vehicle Charging Piles: What Plastics Are Used in Each Part? How to Select Economically and Safely?

The charging connector (including plugs and sockets), as the core interface for current transmission, must possess excellent ...

A Comprehensive Analysis of Plastic Material Selection for New Energy Vehicle Charging Piles: What Plastics to Use for Each Component? How to Choose Economi…

As key outdoor equipment, the performance of the outer shell materials of new energy vehicle charging piles directly impacts ...
IEEE

Optical Multi-Chip Interconnect Bridge (OMIB™) Interposer Assembly Process to Enable High-Density Photonic Interconnects for High-Performance Computing Applications

Abstract: As next-generation high-performance computing applications drive complex heterogeneous integration schemes that are currently limited by beachfront of the XPU, further scaling is highly ...