Probabilistic Ising machines (PIMs) are advanced and specialized computing systems that could tackle computationally hard ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

It will already be appreciated that an RPD is the sum of a number of components. In this part of the series we describe a method of building these components into a design and emphasize the importance ...

SIDTM Pune Announces MBA in Digital & Telecom Management. Admissions Open via SNAP 2025 - Apply Now for a Future-Ready Career in Digital Innovation and Telecom Leadership ...

Sai Abhideep Pundla has been awake since 3 a.m. After a red-eye flight from Las Vegas, where he briefed data center company executives and local government officials about the future of artificial ...

As more companies and startups join forces with government and academia in chip design projects, issues around data sharing, ...

Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.

In the realm of contemporary educational transformation, Challenge-Based Learning and Design Thinking have emerged as pivotal ...

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