Abstract: The stack structure of REBCO tapes is an effective way to increase the current carrying capacity. However, under the influence of anisotropy and high aspect ratio, REBCO tape has a low ...
Abstract: Cu-Cu bonding is widely used in 3-D stacking for chip interconnection. However, noncoplanarity of Cu pillars can significantly influence the reliability of the stacked chips. In this work, ...
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This repository contains the C programming assignments and lab exercises for the 3rd semester lab of the DS (Data Structure) course. The projects demonstrate various concepts of data structures, ...
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