James undergoes a new project - delidding an Intel 12900k processor and then Direct Die Cooling. Today we present Part 1, ...

Intel's next-gen desktop CPU Nova Lake won't be pure 18A, it seems... but at least it'll have some 18A compute.

Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine.

The Intel Arc B570 and B580 use the G21 die. However, a larger, more powerful G31 Battlemage die has been rumoured for what ...

The B570 model we got in for review is the ASRock Intel Arc B570 Challenger 10GB OC. Intel and its board partners report ...

Nova Lake is expected to require a new socket, and unless Intel ports Panther Lake to a desktop, LGA 1851 could be one of the ...

Due around the 2026 or 2027 time frame, Intel hasn't explicitly said which production node will be used by Nova Lake, but ...

Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

Thanks to a leaked shipping manifest, it looks like Intel may be sending early models of its upcoming Nova Lake CPUs to a ...

Close-up of Silicon Die are being Extracted from ... by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process. Intel stock continues to be volatile, though ...

Baya Systems, a chip technology company that wants accelerate intelligent computing, raised $36 million in funding.