The African Development Bank has mandated its second hybrid bond, having delivered the first public hybrid trade by a supranational agency in January 2024. The Ivory Coast-based supra has mandated BNP ...
Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States Beckman Institute for Advanced Science and Technology, University ...
Abstract: A surface pretreatment is a critical process in low-temperature Cu/SiO2 hybrid bonding, significantly improving the quality of bond for both the Cu–Cu and SiO2–SiO2 interfaces. Previously, ...
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing ...
Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx. US$350 million) ...
Fujian Provincial Key Laboratory of Advanced Materials Oriented Chemical Engineering, College of Chemistry and Materials Science, Fujian Normal University, Fuzhou 350007, China State Key Laboratory of ...
Abstract: The microstructure of Cu plays a crucial role in the formation of Cu-to-Cu metal bonds during the hybrid bonding process. This study demonstrates that controlling the grain size of copper ...
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