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Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing ...

Abstract: A HfO2 -SiO2 hybrid bonding technology applied for three-dimensional memristor integration is developed, and the bonding mechanism is deeply studied. This bonding method mainly includes ...

With Dr. No, Ursula Andress established the Bond girl standard for every James Bond movie since. Here are 13 behind the scenes images of her on the set of the first 007 film. Both make great ...

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration ...

Pamela Anderson and Liam Neeson definitely had a lot of fun filming their long-awaited Naked Gun reboot. Between constantly singing one another’s praises and even sharing a kiss on the cheek at Naked ...

Abstract: Recent advancements in semiconductor technology have shifted the focus of innovation toward advanced packaging technologies featuring heterogeneous integration. Among these, hybrid bonding ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

LENZING, Austria — July 3, 2025 — The Lenzing Group, a leading global supplier of regenerated cellulose fibers for the textile and nonwovens industries, has successfully placed a new hybrid bond with ...

PARIS--(BUSINESS WIRE)--Regulatory News: Veolia (Paris:VIE) has successfully completed its first ever green bond issuance, for 500 million euros. It takes the form of deeply subordinated perpetual ...