Abstract: We demonstrate a low-loss silicon nitride fiber-to-chip edge coupler utilizing a multimode interference beam combiner. An average coupling loss of 1.6 dB/facet is achieved for four devices ...
The demand for advanced chips to power artificial intelligence is only growing, and one efficiency-focused company is preparing to make its initial public offering amid the boom. Ambiq Micro Inc.
On 16 September, British semiconductor design firm ARM opened a new engineering office in Bengaluru, where it will design 2-nanometre semiconductor chips. A day later, Japanese chip design firm ...
iFixit has given Apple's slimline new smartphone, the iPhone Air, a thumbs-up for repairability, praising its easy access to key components, despite being the thinnest handset Cupertino has built so ...
Apple will put its next-generation R2 chip based on TSMC's 2nm process inside a future Apple Vision Pro, making the headset the showcase for its most advanced silicon. The company is expanding its ...
The Ascend series is Huawei's main competitive offering to Nvidia's AI chips and its current chip on the market is the Ascend 910C. Huawei is planning three new series over the next three years, ...
When Allied tanks struggled against Normandy’s thick hedgerows, a simple invention turned the tide. Sparked by a soldier’s frustration and built from German beach obstacles, the Rhino device let ...
I remember a time when Destiny 2 used to be the big thing. While I'm more of a fantasy enthusiast than an intergalactic traveler, I've always had Bungie's mammoth MMO in the back of my mind as ...
Samsung’s Galaxy S26 family is shaping up to be one of its most ambitious launches in years, and the company’s next in-house processor looks to be at the center of it. According to a report from FN ...
A recent TikTok showing a quick, clean way to clear and guard against slow-draining sinks has gone viral. Prevent sink clogs the easy way! Just once a week: Baking soda, dishwashing liquid, White ...
Abstract: For multi-chip stacking using Chip-to-Wafer (C2W) Hybrid Bonding (HB) technique, one prominent approach is Inter-Die Gap Filling (IDGF) method. A major challenge in IDGF flow is achieving ...
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