Here is how designers can break functional systems into sub-functional chiplets and use advanced packaging integration ...

SANTA CLARA, CA September 26, 2025 - - Interview Kickstart announced the expansion of its Machine Learning Course curriculum ...

Cadence’s Jasmine Makhija provides an overview of the TEE Device Interface Security Protocol (TDISP), which helps safeguard ...

Here is the essential context and technical depth for practitioners working toward highly integrated, efficient, and ...

Launching a pilot 'chip design to tapeout' flow curriculum, enabling academic institutions with industry-aligned coursework. Pilot testing underway at over 40 select worldwide universities with intent ...

Microsoft is diversifying its AI strategy by integrating Anthropic's models into its 365 Copilot, offering an alternative to ...

Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.

Apple's decision to design its own chips has helped it exert more control over the capabilities of the iPhone 17 lineup. It will also help further its AI ambitions.

Catch up on the top artificial intelligence news and commentary by Wall Street analysts on publicly traded companies in the space with this daily ...

The computing chips that power artificial intelligence consume a lot of electricity. On Wednesday, the world's biggest ...

On August 28, 2025, the Siemens EDA Annual Technology Summit "Siemens EDA Forum 2025" concluded in Shanghai. This industry event, which gathered global technology experts, industry partners, and key ...