Core electron bonding may not always require extreme pressure, study finds

You probably learned in high school chemistry class that core electrons don't participate in chemical bonding.
University at Buffalo

Core electron bonding may not always require extreme pressure

Research suggests some metals’ semicore electrons may be more active on Earth’s surface than previously thought.
New Scientist

Electrons inside graphene have been pushed to supersonic speeds

Making electrons flow like a liquid is difficult, but inside graphene researchers forced them to move so fast that they ...

Century-Old Mystery Solved: Scientists Measure a Fraction of an Electron, Unlocking the Secret to Catalysis

The discovery could significantly reduce the production costs of fuels, chemicals, and materials. A research team from the ...
Phys.org

Covalent bonds found in alpha plutonium clarify its unusual atomic structure

Plutonium has captured the attention of scientists since its discovery in the early 1940s. This enigmatic element has an important role to play in emerging energy technologies like nuclear batteries ...
Nature

Electron transfer articles from across Nature Portfolio

The transmission spectrum of single-molecule junctions provides fingerprint information on the charge-transport properties. A technique called single-molecule photoelectron tunnelling spectroscopy has ...
C&EN

ACS Meetings & Expos

Where thousands of chemistry professionals meet to share ideas and advance scientific and technical knowledge. Sharing your passion for chemistry, connecting with one of the world's largest scientific ...
Harvard Business Review

The Work of Leadership

Followers want comfort, stability, and solutions from their leaders. But that’s babysitting. Real leaders ask hard questions and knock people out of their comfort zones. Then they manage the resulting ...
IEEE

A Fan-Out Panel Level Packaging (FOPLP) Structure Achieving Double-Sided Die Bonding Interconnects Through Copper Through-mold Vias (TMVs)

Abstract: With the advancement of semiconductor devices toward high performance, high power density, and miniaturization, modern chip packaging technologies face increasingly stringent requirements ...
IEEE

First Demonstration of Superior Characteristics of Co-Co Bonding with Passivation Structure at Low Thermal Budget for Advanced Packaging and Ultrafine Pitch Applications

Abstract: This study investigates Co-Co direct bonding with and without Ag passivation, with a focus on bonding quality and electrical performance. Bonding quality was confirmed through SAT and SEM ...
C&EN

The Role of Halides in the Bonding and Electronic Structure of Actinyl(VI) Halides─Energy Match Driven Stability

Institute for Nuclear Waste Disposal (INE), Karlsruhe Institute of Technology (KIT), Kaiserstraße 12, 76131 Karlsruhe, Germany Radioactive Waste Disposal and Environmental Remediation (RADER), ...
C&EN

Organic Halogen Substitution-Driven Halogen Bonding Induces Polar 3D Supramolecular Framework and Second-Harmonic-Generation Response

Fujian Provincial Key Laboratory of Advanced Materials Oriented Chemical Engineering, College of Chemistry and Materials Science, Fujian Normal University, Fuzhou 350007, China State Key Laboratory of ...