Abstract: Existing supervised and semisupervised methods for synthetic aperture radar (SAR) image change detection are limited by the scarcity of labeled data and the challenges of modeling ...
Last year, we celebrated 50 years since the first papers on fluorescence correlation spectroscopy (FCS) were published. It wasn't a wild celebration with masses on the streets, nor was it widely ...
Abstract: The long-tailed data distribution frequently occurs in the real-world scenarios, whereas deep learning is not effective enough for such distribution. In order to improve the effectiveness ...
Data centers are proliferating in Virginia and a blind man in Baltimore is suddenly contending with sharply higher power bills. The Maryland city is well over an hour’s drive from the northern ...
Gift Article 10 Remaining As a subscriber, you have 10 articles to gift each month. Gifting allows recipients to access the article for free. Gov. JB Pritzker has appointed 13 members to a new ...
This article was originally published by The Conversation. After the Sept. 10, 2025, assassination of conservative political activist Charlie Kirk, President Donald Trump claimed that radical leftist ...
A panel of vaccine advisers to the federal government debated several changes to COVID-19 vaccine access in a chaotic meeting Friday, marked by confusion over processes, technical difficulties and ...
The Wichita Falls Economic Development Corporation on Thursday took a step toward having a large data center locate here. The board voted to sell more than 225 acres in the Wichita Falls Business Park ...
School of Chemical Engineering, Changchun University of Technology, Changchun 130012, Jilin, People’s Republic of China ...
At the “Make with Notion” event on Thursday, the company announced the launch of its first AI agent. The agent will draw on all of a user’s notion pages and database as context, automatically ...
The semiconductor industry is entering an era defined by heterogeneous integration and complex packaging technologies. Innovations such as wafer-on-wafer bonding, chiplets, multi-stacked die (2.5D/3D) ...
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