Abstract: In this paper, the gate-level techniques for mitigation of Single Event Transients (SETs) in combinational circuits have been analyzed. The main objective was to compare the SET mitigation ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Featuring 2.5-kV capacitive isolation, the Littelfuse IX3407B gate driver improves signal integrity and safety in power conversion systems.

Turning genes on and off is like flipping a light switch, controlling whether genes in a cell are active. When a gene is ...

As more companies and startups join forces with government and academia in chip design projects, issues around data sharing, ...