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Microsoldering with a common soldering iron | Attiny 85 QFN20

This is the most complex or detailed soldering I've done so far, the QFN20 package is very small but still not impossible to solder using conventional tools. In this video I make a functional circuit ...
IEEE

Re-Weighted Constrained Feature Characterization Method Study for Flip Chip Solder Joint Vibration Signals

Abstract: Flip chip technology has been extensively adopted in integrated circuit (IC) packaging, and the integration of flip chip technology with solder joint interconnection methods has been ...
IEEE

Compact Interleaved PCB Rogowski Coil Array for Chip Current Measuring in SiC MOSFET Power Modules

Abstract: The use of PCB Rogowski coils to measure chip currents in power modules may significantly help address current imbalance problems that lead to derating or overcurrent failure. Compared to ...
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Shiyun Circuit: The new generation of PCB product 'Chip Innovation Intelligence Carrier' expected to start production in mid-2026, may supply Tesla in the future

On September 18, Shiyun Circuit announced in its investor relations activity record that the new generation PCB product 'Chip Innovation Intelligence Carrier' has a high technological content and ...