OpenAI has announced a collaboration with chipmaker Broadcom to design its own AI computer chips. The companies plan to start ...

Traditional EDA tools rely on heuristics and static algorithms, which struggle to scale with modern design complexity. AI ...

Stacking dies will dramatically improve performance, but it’s still a work in progress.

Programmable photonics devices, which use light to perform complex computations, are emerging as a key area in integrated ...

Cadence’s AI design flows now support TSMC’s N2 and A16 technologies, while new silicon-proven IP is available for TSMC N3P.

Indian chip design industry's growth, challenges, and potential highlighted by experts, emphasizing the need for innovation and collaboration for success.

In the blistering heat of the Arizona desert, Intel staged a quiet revolution. At the Intel Technology Tour 2025 in Phoenix, ...

Cambridge GaN Devices (CGD) has entered a manufacturing partnership with GlobalFoundries (GF) to produce its ICeGaN power ...

SNPS expands its TSMC partnership, advancing AI, SoC, and multi-die design with certified flows, IP, and 3DIC innovations.

The backside of the wafer refers to the opposite surface of the silicon wafer from where the transistors and circuits are ...

The question is whether the megadeal system is sustainable. When capital leads the revolution, corrections can be brutal—but ...

AI and data center chips are hitting limits. A new 3D chip design improves speed, power use and memory bandwidth.