IEEE

Optimizing Through-Silicon Via (TSV) Filling: Effects of Copper Ion Concentration and Additive Molecular Weight in Stepwise Direct Current Electrodeposition

Abstract: 3D packaging has emerged as a promising solution due to its advantages in integration density, lightweighting, compactness and cost-effectiveness. Through silicon vias (TSV) technology plays ...
C&EN

Achieving High Potential Stability of Solid-Contact Ion-Selective Electrodes: The Role of Solution with the Primary Ion Preconditioning of the Membrane Cocktail

Residues and Resource Reclamation Centre, Nanyang Environment and Water Research Institute, Nanyang Technological University, 1 Cleantech Loop, CleanTech One, Singapore 637141, Singapore ...
IEEE

RF-LqRNN:RFID-Based Concentration Detection of Alcohol Solutions and Glucose Solutions

Abstract: Solution concentration detection plays an important role in many real-life applications. For example, alcohol concentration detection can prevent cases where low-concentration liquor red is ...