A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...
With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.
Many technologies rely on electric discharge phenomena, including consumer electronics, medical devices, and high-voltage power systems. During product development, it is highly beneficial to simulate ...
Abstract: This article proposes a framework for multiphysics modeling and co-simulation of electrified ships, aimed at system-level verification. The framework encompasses the development of dynamic ...
Abstract: The harsh electromagnetic environment poses a threat to the reliability and safe operation of Gallium nitride (GaN) radio frequency and microwave high-electron-mobility transistors (HEMTs).
Some results have been hidden because they may be inaccessible to you
Show inaccessible results