Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...

Launched in collaboration with the Museum of Modern Art (where the original work resides), this LEGO reproduction of Van Gogh's "The Starry Night" uses 3D to mimic the master's thick brushstrokes. Van ...

Despite Mario reaching his 40th anniversary this year with Super Mario Bros, we’re about to approach the 30th anniversary since Mario made his 3D debut with Super Mario 64 in 1996. This became a ...

Former Chicago Bears star Charles "Peanut" Tillman found a second career your rarely see from former NFL players: FBI agent. That job has now come to an end. The Pro Bowl cornerback explained his ...

Peter Thiel, the billionaire investor in data, AI, defense and weapons development technology companies, wants everyone to think more about the end of the world. For about a year now, Thiel has been ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

Romy Ellenbogen is a Tallahassee correspondent, covering state government with a focus on criminal justice and health. Reach her at [email protected]. Anyone can view a sampling of recent ...

Jennifer Kinsey is general manager and commercial business unit leader in the Nashville office of Atlanta-based contractor Reeves Young. Opinions are the author’s own. In an industry full of smart, ...

Thomas S. Monson once said, “You can’t be right by doing wrong; you can’t be wrong by doing right. Your personal conscience always warns you as a friend before it punishes you as judge.” This profound ...