3D-printed metamaterials harness complex geometry to dampen mechanical vibrations

In science and engineering, it's unusual for innovation to come in one fell swoop. It's more often a painstaking plod through ...
Semiconductor Engineering

System-HW Co-Design Approach Combines Mono3D DRAM, NMP, and GPU Acceleration (UCSD, Georgia Tech, UIUC, Illinois Tech)

System-Hardware Co-Design with Tiered Monolithic 3D-Stackable DRAM for Efficient MoE Serving” was published by researchers at ...

I used the Bambu Lab P2S for over 300 hours, and here's why it's almost perfect

The Bambu P2S is the hotly anticipated successor to the best-selling Bambu Lab P1S, and in every way, it's a significant ...

Inside OpenAI & Broadcom’s Bold Partnership : New AI Chips Announced

Discover how OpenAI and Broadcom’s custom AI chips are set to redefine technology with 10 gigawatts of computing power & ...