3d
Microsoft says this new cooling method could enable more powerful chips and efficient data centers
Typically, a data center might use fans to pass cool air over a chip. A more advanced technology that Microsoft employs for ...
While connectors are essential components of nearly every electronic application, they can be easily overlooked by design ...
The Series 7 DPO oscilloscope from Tektronix is the company’s first new high-end model in years. It uses an optical port to ...
Emerging chiplet, memory, and interconnect technologies demand layered, automated solutions to deliver predictable ...
Tech Xplore on MSN
From VR headsets to flexible phones: Micro-LEDs aim to overcome size and brightness challenges
A Texas A&M University chemical engineering professor is helping chart the path for micro light-emitting diode displays—known as micro-LEDs—that could transform how future electronic devices are ...
Nordic Semi's nRF54LM20A is a new Cortex-M33-based high-memory wireless MCU part of the nRF54L Series with double the SRAM and higher flash capacity ...
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