US chipmaker Texas Instruments’ forecast signals semiconductor slump is persisting: Summary Texas Instruments forecasted weaker-than-expected Q1 earnings, citing sluggish chip d ...
Summary The HiPEAC 2025 conference in Barcelona highlighted quantum computing’s transformative potential, emphasizing European collaboration to integrate it with high-performance computing. Key ...
Summary Texas Instruments shares plummeted 7.5% on Friday, marking their worst drop since 2020, after a disappointing earnings forecast revealed sluggish demand and rising manufacturing costs. The ...
Alphabet Inc pushes global initiative to educate workers and lawmakers on AI: Summary Google is ramping up efforts to shape AI po ...
Samsung Faces Struggles Ahead as Foundry Investment Reportedly Slashed by Half: Summary Samsung's foundry division faces challenges as it slashes 2025 facility investments to KRW ...
As the data-driven world continues to accelerate, so is the demand for faster, more energy-efficient and scalable data ...
Updates on Huawei's Advancements and Big Fund's Semiconductor Moves: Summary China is advancing its AI and semiconductor industries despite U.S. export co ...
Summary The chiplet industry surged with major developments this week. Baya Systems secured $36M to expand its AI and RISC-V chiplet solutions. Arm released its first chiplet system architecture ...
Summary Samsung unveiled the Galaxy S25, featuring Qualcomm chips and Google’s AI model, aiming to boost sales and outpace Apple and Chinese rivals. With personalized AI features, unchanged prices, ...
Scale AI CEO says China has quickly caught the U.S. with the DeepSeek open-source model: Summary China's DeepSeek AI lab disrupted the U.S. dominance in AI with groundbreaking mod ...
Summary AI is transforming the semiconductor industry, driving 26% of its $600 billion market in 2024. At the AI Executive Conference, leaders highlighted AI's role in boosting manufacturing ...
Summary High-NA EUV lithography is revolutionizing IC fabrication, enabling sub-2nm nodes with greater feature density but introducing challenges like stitching effects and edge placement errors.
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