Abstract: Bonding failures are a common source of abnormal electrical signals in failing devices. While major defects are easily identifiable, detecting subtle wire bond failures remains challenging.
1d
Our engineering team is making versatile, tiny sensors from Nobel-winning metal-organic frameworks
When the 2025 Nobel Prize in Chemistry honored Omar Yaghi—the "father of metal-organic frameworks," or MOFs—along with Susumu ...
Abstract: In this article, a novel approach is proposed to address sensors’ significant challenges by introducing a portable planar microstrip sensor based on a dual-bandpass filter (BPF). This sensor ...
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