Abstract: The multichip insulated gate bipolar transistor (IGBT) module has been widely used in the converter with high-power capacity. However, multichip IGBT module usually suffers from ...
Abstract: High-density packaging of fast-switching power semiconductors typically requires low parasitic inductance, high heat extraction, and high thermo-mechanical reliability. High-density ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback