Abstract: Heterogeneous 3D integration technology is a cost-effective and high-performance alternative to planar integrated circuits (ICs). In this paper, we propose an on-chip power distribution ...

SpaceX is offering the clearest look yet at the next major upgrade to Starlink, confirming the upcoming “V3” satellite is ...

In science and engineering, it's unusual for innovation to come in one fell swoop. It's more often a painstaking plod through ...

Abstract: The mismatch in thermal expansion coefficients among different materials leads to nonuniform deformation in a package, known as warpage. The warpage has become a significant reliability ...