This is the most complex or detailed soldering I've done so far, the QFN20 package is very small but still not impossible to ...

Abstract: Solder bump bridging (SBB) induced during chip attach process could cause electrical failure and device to malfunction. These SBB defects went undetected due to complex circuitry, test ...

Abstract: The diffusion soldering process has attracted much interest following the development of new wide band gap materials, such as SiC chips as well as the need to address the higher reliability ...

I had this idea of building my own bicycle lighting system totally personalized, the lights would have the exact lighting ...