A new technical paper titled “On the Thermal Vulnerability of 3D-Stacked High-Bandwidth Memory Architectures” was published by researchers at North Carolina A&T State University and New Mexico State ...

Gentex Corp. is partnering with Anduril to provide helmet and communications integration for the U.S. Army’s Soldier Borne Mission Command (SBMC) program. Credit: Gentex WASHINGTON — Maxar ...

Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...

Master Midjourney V7 for architectural visuals in 2025 with a clear, step-by-step workflow. Learn how to structure effective prompts, refine and upscale renders, maintain clean geometry, and turn ...

Learn how DenseNet works and why it’s a powerful architecture in deep learning. This tutorial breaks down DenseNet’s key concepts, including dense connections, feature reuse, and parameter efficiency ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...

Without the slightest fanfare, AMD has added a new "X3D" model with 3D V-Cache to its CPU lineup. Give it up, ladies and germs, for the new Ryzen 5 5500X3D (thanks to X user MEGAsizeGPU for spotting ...

A new technical paper titled “Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock” was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon ...

AMD Zen 5 is the next-generation Ryzen CPU architecture for Team Red, and its gunning for a spot among the best processors. After a major showing in June, the first Ryzen 9000 and Ryzen AI 300 CPUs ...

BEAVERTON, Ore.--(BUSINESS WIRE)--Today the Universal Chiplet Interconnect Express™ (UCIe™) Consortium announced the release of its 2.0 Specification. The UCIe 2.0 Specification adds support for a ...