Mînzu, V. and Arama, I. (2025) A New Method to Predict the Mechanical Behavior for a Family of Composite Materials. Journal ...
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...
LCGC International spoke to Maria Hayder, corresponding author of a recently published paper (1) discussing a novel workflow ...
Growing III-V nano-ridge lasers directly on silicon sidesteps the complexities of existing integration methods and paves the way for scalable, cost-efficient photonic integrated circuit production.
Whether you’re just starting your intensification journey or looking to scale it to the next level, this eBook offers the strategic foundation and operational perspective to help you move forward.
This title is part of a longer publication history. The full run of this journal will be searched. TITLE HISTORY A title history is the publication history of a journal and includes a listing of the ...
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