A new design paradigm combines mechanical, electrical, thermal, and optical aspects in an integrated system concept.
MKS Inc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, announced today that its ...
Packaging Gateway on MSN
Sun Chemical and Onlineprinters co-develop sheetfed inks
Sun Chemical and Onlineprinters have jointly developed and optimised a new sheetfed process ink range, SunLit ProPace.
Lam Research Corporation (NASDAQ:LRCX) is one of the best performing NASDAQ stocks according to hedge funds. On October 2, ...
Packaging coating maker Inhance Technologies is pushing back on the Association of Plastic Recyclers decision to pause recognition of fluorinated packaging in its recyclability guidance.
Packaging Gateway on MSN
Coexpan and Eslava to recycle polystyrene for food packaging
Coexpan and Eslava are to develop a process for decontaminating post-consumer polystyrene (rPS) and recycling it into ...
tom's Hardware on MSN
Applied Materials preps for 'Angstrom Era' in chipmaking — spearheaded by its new Kinex, Xtera, and PROVision 10 systems
Applied Materials has introduced three new chipmaking systems that are set to mark the beginning of the 'angstrom' and 3D ...
Procter & Gamble and LasX Industries have applied their laser marking technology to bottle caps for Tide Ultra OXI Boost ...
The U.S. AI ecosystem is evolving into a tightly interdependent network, with major firms financing each other’s capacity in ...
Intel CEO Lip-Bu Tan holds a wafer of CPU tiles for the Intel Core Ultra series 3, code-named Panther Lake, outside the Intel ...
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