Abstract: In this work, a highly linear temperature sensor based on a silicon carbide (SiC) p-n diode is presented. Under a constant current biasing, the diode has an excellent linear response to the ...

As the AI boom drives demand for advanced packaging, chip testing at the backend is facing challenges in temperature, ...

Graphene, which is comprised of a single layer of carbon atoms arranged in a hexagonal lattice, is a widely used material ...

Abstract: The core chip of the power device generates significant heat during operation, which requires sufficient heat dissipation through leads and packaging materials. Printed circuit board (PCB) ...