Since its initial release in 2008, interCAD has evolved into a comprehensive ECAD platform supporting schematic, PCB layout, ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Discover the fundamentals of hybrid relays and explore why they are becoming a go-to choice for engineers and makers alike.

Abstract: This article presents a novel torque senor, which functions according to the deformation of a printed circuit board that carries sensitive elements and can also serve as a sensor. The ...

FLIP: Benchmark tasks in fitness landscape inference for proteins Christian Dallago, Jody Mou, Kadina E Johnston, Bruce Wittmann, Nick Bhattacharya, Samuel Goldman, Ali Madani, Kevin K Yang NeurIPS ...