A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...
With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.
Belgian chip research hub imec will appoint Patrick Vandenameele as its new chief executive with current CEO Luc Van den hove becoming chairman, the company told Reuters on Monday.
Tech Xplore on MSN
Light-triggered process lets 3D printers create custom glass structures without glue or high temperatures
Researchers have developed the first binder-free method for 3D printing glass, using light to trigger a chemical reaction ...
Alphawave Semi's UCIe-3D 5nm bottom die supports TSVs to supply power and ground to the 3nm top die. The company's 3DIO portfolio also includes a proprietary design flow and methodology for fast and ...
Live Science on MSN
Microsoft unveils new liquid-cooled computer chips — they could prevent AI data centers from massively overheating
Microsoft engineers have developed a microfluidics chip-cooling technique that removes heat more efficiently and could ...
MIRTEC is participating in the 2025 Semicon West, where it will showcase its advanced semiconductor inspection system MV-9SIP ...
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