The African Development Bank has mandated its second hybrid bond, having delivered the first public hybrid trade by a supranational agency in January 2024. The Ivory Coast-based supra has mandated BNP ...

Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing ...

Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx. US$350 million) ...

The 39-year-old emphasized the importance of camaraderie while imparting a passionate message ahead of a tune-up event this weekend at the Procore Championship. Bradley has fully embraced his role at ...

SoftBank Group Corp. set terms for a ¥200 billion ($1.3 billion) hybrid bond at a coupon of 4.556%, topping Japan Airlines Co.’s perpetual subordinated notes and setting the highest coupon for a ...

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration ...

Pamela Anderson and Liam Neeson definitely had a lot of fun filming their long-awaited Naked Gun reboot. Between constantly singing one another’s praises and even sharing a kiss on the cheek at Naked ...

A new technical paper titled “Hybrid Bonding with Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography” was published by researchers at Seoul National University of Science and ...

Abstract: Recent advancements in semiconductor technology have shifted the focus of innovation toward advanced packaging technologies featuring heterogeneous integration. Among these, hybrid bonding ...

LENZING, Austria — July 3, 2025 — The Lenzing Group, a leading global supplier of regenerated cellulose fibers for the textile and nonwovens industries, has successfully placed a new hybrid bond with ...

Arkema (Paris:AKE) successfully completed today a €400 million undated hybrid bond issue with an annual coupon of 4.25% and a first call date after 5 years. The proceeds of this issue, which ...