Lone Pine is an adventure game about exploring a national park with only your wits and a backpack you can fill with items ...

Plans are the master templates of our design, they are a medium to take our idea to the final machine, in this video we'll ...

Wicked' director Jon M. Chu premiered a new 'For Good' clip at London Film Festival and said he created Tin Man and Scarecrow ...

Publisher and developer Square Enix, and developer Artdink Corporation have released new information and screenshots for Dragon Quest I & II HD-2D Remake introducing some of Dragon Quest ...

Abstract: In this letter, we use two parallel coprime arrays to localize the jamming source. The classical Two-Dimensional (2D) Direction of Arrival (DOA) estimation primarily relies on unstructured ...

The Second Circuit affirmed the decision of a federal district court in New York dismissing a former congressman’s action for copyright infringement, breach of contract, and fraudulent inducement ...

Abstract: Augmented Reality (AR) teleconferencing allows spatially distributed users to interact with each other in 3D through agents in their own physical environments. Existing methods leveraging ...

Copilot 3D will turn your 2D images into 3D models. The tool is freely available to anyone, though you do need a Microsoft account. Microsoft suggests using an image with a single subject, even ...

What occurs during the melting process in two-dimensional systems at the microscopic level? Researchers at Johannes Gutenberg University Mainz (JGU) have explored this phenomenon in thin magnetic ...

Square Enix has released a new trailer for Dragon Quest I & II HD-2D Remake dubbed “Edrick’s Legacy,” as well as the latest information and screenshots. Get the details below. —As you continue ahead ...

Summary: Researchers have uncovered how primate brains transform flat, 2D visual inputs into rich, 3D mental representations of objects. This process, dubbed “inverse graphics,” works by reversing the ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.