Abstract: Ultrasonic heavy aluminum wire bonding whose wire diameter is greater than 100 microns has been the dominant interconnection technology in IGBT modules to implement the electrical connection ...
Abstract: Technological progress and market pressure force SoC (System on Chip) design companies to adopt higher speed interface to meet the demand of bandwidth for large amount of data transmission.
Migration notes: version 3.0.x version 3.1.x version 3.2.x version 4.x.x version 5.x.x version 6.x.x version 6.2.x version 7.0.x version 7.2.x version 8.0.x version 9 ...
Note that the kernel modules built here must be used with GSP firmware and user-space NVIDIA GPU driver components from a corresponding 580.95.05 driver release. This can be achieved by installing the ...
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