Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density.
Siemens Digital Industries Software is collaborating with Advanced Semiconductor Engineering (ASE), to develop a 3Dblox-based ...
Synopsys announced its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP ...
Adtran today announced its role in the OIF’s open, multi-vendor interoperability demo at ECOC 2025 and highlighted ...
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🧩 Entangled atoms at long distance: quantum computing takes a giant leap
An experiment conducted by a team from the University of New South Wales (UNSW) demonstrates that two atomic nuclei can be entangled through the mediating action of electrons. This work, published ...
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