Semiconductor Engineering

How 3D-IC Will Change Chip Design

Stacking dies will dramatically improve performance, but it’s still a work in progress.
C&EN

Design of Ultraviolet Multiple-Resonance TADF Materials Enabled by Phosphine Oxide/Sulfide-Based Polycyclics with Accelerated Reverse Intersystem Crossing

State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China *Ping Li - State ...
IEEE

Multiple Dielectric Isolation Layer to Improve Programming Interference in 3D Charge-Trapping NAND Flash Memory

Abstract: In three-dimensional (3D) NAND flash device, the spacer length decreases as the number of stacks increases in order to achieve high density and small size. As the spacer size of the device ...
WAAY-TV

Marshall County man accused of possessing child sex abuse material arrested on multiple charges

A man from Arab is accused of possessing child sexual abuse material, according to newly filed court documents. Marshall County Jail records show Arab Police arrested 39-year-old Kyle Joiner Friday.
IEEE

3D-Printed Soft Magnetic Cores For Compact Electromechanical Devices Via Material Extrusion

Abstract: This paper reports the fabrication and characterization of 3D-printed, soft magnetic cores manufactured via material extrusion that attain a relative magnetic permeability above 30. The ...
C&EN

Magnetic Nanoparticle-Induced Cell 3D Magnetic Levitation Culture and Drug Evaluation Study

State Key Laboratory of Digital Medical Engineering, School of Biological Science and Medical Engineering & Basic Medicine Research and Innovation Center of Ministry of Education, Southeast University ...