Abstract: Warpage and residual stresses in plastic electronics packages are partly due to the shrinkage of the epoxy molding compound during the cure stage and partly due to the mismatch in thermal ...
The full-time work-from-home thing is getting to be a drag. If you've been entirely remote for the better part of the past decade, the shine of logging on in sweats on the couch at 9:01 a.m. has lost ...
Abstract: This technical note studies state estimation problems subject to data loss. We consider a class of switched estimators, where missing data is replaced by optimal estimates. The considered ...