Tech Xplore on MSN

3D printed parts now match digital designs more closely with new modeling technique

People are increasingly turning to software to design complex material structures like airplane wings and medical implants. But as design models become more capable, our fabrication techniques haven't ...
Semiconductor Engineering

First Forays Into True 3D-IC Designs

Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.
Digi Times

TSMC updates

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate... Taiwan's MediaTek, ...