OpenAI has announced a collaboration with chipmaker Broadcom to design its own AI computer chips. The companies plan to start ...

Stacking dies will dramatically improve performance, but it’s still a work in progress.

Cadence’s AI design flows now support TSMC’s N2 and A16 technologies, while new silicon-proven IP is available for TSMC N3P.

Cambridge GaN Devices (CGD) has entered a manufacturing partnership with GlobalFoundries (GF) to produce its ICeGaN power ...

CN Bio, a leading provider of benchtop Organ-on-a-chip (OOC) solutions that accelerate drug discovery and development, ...

The backside of the wafer refers to the opposite surface of the silicon wafer from where the transistors and circuits are ...

In the blistering heat of the Arizona desert, Intel staged a quiet revolution. At the Intel Technology Tour 2025 in Phoenix, ...

The question is whether the megadeal system is sustainable. When capital leads the revolution, corrections can be brutal—but ...

Cambridge GaN Devices (CGD) has announced that it is working with GlobalFoundries (GF) to strengthens CGD's fabless strategy, ...

Global semiconductor supply chain faces disruptions from escalating trade war between China and US over rare-earth minerals ...

There’s been a significant interest in Intel’s next-generation chips: codenamed Panther Lake for PCs and Clearwater Forest for servers. Read more ...

Cisco has unwrapped a high-end, 51.2 Tbps router and chip that it says will go a long way toward supporting the distributed ...