A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...

With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.

Abstract: The harsh electromagnetic environment poses a threat to the reliability and safe operation of Gallium nitride (GaN) radio frequency and microwave high-electron-mobility transistors (HEMTs).

Abstract: This article proposes a framework for multiphysics modeling and co-simulation of electrified ships, aimed at system-level verification. The framework encompasses the development of dynamic ...