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Researchers have proposed process flow guides for 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet-engine ...

(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...

The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new ...

This is a comprehensive list of the best flowchart software, covering features, pricing and more. Use this guide to determine the most suitable software for you. There comes a time when certain ideas, ...

SUTD, SUSTech and ZJU researchers' proposed process flow guides 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in ...