Corgan, HDR, Gensler, Stantec, AECOM, HKS, Page, HED, Arcadis North America, and DGA top Building Design+Construction's ...

Burns & McDonnell, Jacobs, WSP, HPE Sustainable Data Center Modernization, Woolpert, Kimley-Horn, Olsson, and EXP head ...

Meeting the demands of AI at scale won’t be achieved through siloed upgrades or short-term fixes. It requires a holistic approach to design that integrates every component of infrastructure from the ...

By continuously investing in innovation and integrating digital and power electronics technologies, Huawei Digital Power aims ...

New switches with embedded AMD Pensando DPUs are highly adaptive and scalable for AI demands—enabling enterprises to add services as needs evolve As AI workloads multiply, building and managing data ...

Enables AI infrastructure providers to emulate and optimize all aspects of the data center, from the physical layer through the application layer Validates and optimizes system-level performance, ...

To bring advanced chiplet designs to the industry, Arm announced an expansion of the Arm Total Design ecosystem. Announced ...

This is the new asset class—measured not in barrels or ounces, but in workload availability, thermal stability and sovereign ...

The Vera Rubin NVL144 architecture is designed to support the roll-out of 800-volt direct current data centers for the ...

Machine intelligence enables a new era of productivity and is becoming an integral part of our lives and societies across many disciplines and functions. Machine intelligence relies on computing ...

Additionally, to address the power consumption required by increasing computing density, LITEON is unveiling a next-generation integrated power solution, co-developed with NVIDIA, making its first ...

Intel has announced that its new chip fabrication plant, Fab 52, in Chandler, Arizona, is fully operational, and that the ...