Stacking dies will dramatically improve performance, but it’s still a work in progress.

Cadence’s AI design flows now support TSMC’s N2 and A16 technologies, while new silicon-proven IP is available for TSMC N3P.

AI and data center chips are hitting limits. A new 3D chip design improves speed, power use and memory bandwidth.

Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as ...

Launching a pilot 'chip design to tapeout' flow curriculum, enabling academic institutions with industry-aligned coursework. Pilot testing underway at over 40 select worldwide universities with intent ...

The backside of the wafer refers to the opposite surface of the silicon wafer from where the transistors and circuits are ...

Researchers at Fudan University have created a working memory chip just a few atoms thick, and the first to integrate 2D materials with standard silicon circuits.

SNPS expands its TSMC partnership, advancing AI, SoC, and multi-die design with certified flows, IP, and 3DIC innovations.

Cadence Design Systems is a mission-critical enabler of next-gen industries, boasting high recurring revenues, robust client retention, and an AI-driven product portfolio. The company’s oligopolistic ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

Cambridge GaN Devices (CGD) has entered a manufacturing partnership with GlobalFoundries (GF) to produce its ICeGaN power ...