Oyster Bay, N.Y. – Mill-Max's ball grid array socket/adapter systems can socket both BGA devices and interconnecting circuit boards. BGA socket/adapters provide a high-density and low-profile ...

Frenchtown, N.J. – Aries Electronics has begun marketing a side-stackable ball grid array socket. The Pin-Ball Socket can be soldered side-by-side, directly to the existing footprint of a ...

A land grid array/ball grid array socket has been designed for high performance ASIC applications. The new socket has pressure mount contacts on the top and bottom to prevent overstress on the socket.

Semiconductor devices housed in BGAs and µBGAs having up to 2,500 pins and running at speeds well beyond today's fastest ICs can all be tested, debugged and programmed using a series of ...