The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.
It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to new heights.
Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.
Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM ...
Micron Technology (MU) is building a chip plant in Singapore, as part of an approximately $7 billion investment to meet artificial intelligence (AI) data center demand. The new HBM (high bandwidth ...
Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's new $9.5 billion high bandwidth memory (HBM) advanced packaging facility ...
Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.
The facility’s opening will bolster Micron’s technological edge and solidify SG’s position as a critical player in the global ...
Micron plans to invest around $7 billion over the next five years to boost memory chip production in Singapore. The company announced the investment on the same day it broke ground on a new ...
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...
Micron Technology is investing S$9.5 billion ($7 billion) to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for ...
A US$7 billion Micron advanced packaging facility in Singapore will help manufacture high-bandwidth memory (HBM) chips in ...